top of page


Who I Am

  • A solution-driven technologist with expertise in structure-process-property relationships, rheology and capability development for polymers/composites with experience in electronic packaging.

  • Adept at material, design and process development for wafer as well as panel level packaging, including fan-in, fan-out, flip-chip (coreless and thin core) and die-embedding technologies.

  • Experienced in working with domestic and overseas cross-functional teams and partners.

Home: About Me
Home: Welcome
Home: Contact
bottom of page